Huayuan Jinbo at the 3rd China International Liquid Cooling Technology Innovation Development Forum

HUAYUAN JINBO · NEWS & INSIGHTS

Huayuan Jinbo at the 3rd China International Liquid Cooling Technology Innovation Development Forum

10–11 September 2026 · Shanghai · 7 min read

Join the conversation on reliable fluid paths, sensing and future system intelligence for liquid-cooled infrastructure.

Huayuan Jinbo will engage with industry participants at the 3rd China International Liquid Cooling Technology Innovation Development Forum in Shanghai on 10 and 11 September 2026.

The forum brings together the liquid-cooling value chain around thermal design, components, fluid distribution, monitoring, reliability and deployment.

Huayuan Jinbo will contribute its perspective on precision metal bellows, flexible fluid connections, sensor development, electronics and validation. The company welcomes discussions on joint development for pressure, temperature, flow, leak and vibration visibility in liquid-cooling systems.

The goal is practical collaboration: defining requirements, engineering interfaces, validating performance and planning industrialization.

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