Inside Huayuan Jinbo's metal, ceramic and plastic-frame packaging and validation platform.
Sensor performance depends not only on the sensing chip, but also on packaging, interconnection, protection, calibration and validation.
Huayuan Jinbo documents metal, ceramic and plastic-frame packaging process platforms, supported by die bonding, wire bonding, laser welding, inspection and environmental testing.
The company's 5,000 m² sensor cleanroom supports packaging, testing and reliability work, helping connect development programs to repeatable production.
